AMD Quietly Launches Ryzen 7 8700F and Ryzen 5 8400F Processors

AMD has recently expanded its Ryzen 8000 series by introducing the Ryzen 7 8700F and Ryzen 5 8400F processors. Initially launched in China, these chips were added to AMD's...

7 by Gavin Bonshor on 4/11/2024

Intel Teases Lunar Lake At Intel Vision 2024: 100+ TOPS Overall, 45 TOPS From NPU Alone

During the main keynote at Intel Vision 2024, Intel CEO Pat Gelsinger flashed a completed Lunar Lake chip off, much like EVP and General Manager of Intel's Client Computing...

14 by Gavin Bonshor on 4/11/2024

Intel To Discontinue Boxed 13th Gen Core CPUs for Enthusiasts

In an unexpected move, Intel has announced plans to phase out the boxed versions of its enthusiasts-class 13th Generation Core 'Raptor Lake' processors. According to a product change notification...

5 by Anton Shilov on 4/10/2024

Report: Impact of Taiwanese Earthquake on DRAM Output to be Negligible in Q2

Following the magnitude 7.2 earthquake that struck Taiwan on April 3, 2024, there was immediate concern over what impact this could have on chip production within the country. Even...

2 by Anton Shilov on 4/10/2024

Google Develops In-House Arm 'Axion' CPU for Datacenters

Google was among the first hyperscalers build custom silicon for its services, starting first with tensor processing units (TPUs) for its AI initiatives, and then video transcoding units (VCUs...

15 by Anton Shilov on 4/9/2024

Intel Unveils New Branding For 6th Generation Xeon Processors: Intel Xeon 6

At Intel's Vision 2024 event, which is being held in Phoenix, AZ, has seen several key announcements. On the datacenter CPU front, Intel is using the show to unveil...

6 by Gavin Bonshor on 4/9/2024

TSMC to Receive $6.6B Under US CHIPS Act, Set to Build 2nm Fab in Arizona

TSMC has entered into a preliminary agreement with the U.S. Department of Commerce, securing up to $6.6 billion in direct funding and access to up to $5 billion in...

23 by Anton Shilov on 4/8/2024

SK hynix to Build $3.87 Billion Memory Packaging Fab in the U.S. for HBM4 and Beyond

SK hynix this week announced plans to build its advanced memory packaging facility in West Lafayette, Indiana. The move can be considered as a milestone both for the memory...

7 by Anton Shilov on 4/5/2024

PCIe 7.0 Draft 0.5 Spec Available: 512 GB/s over PCIe x16 On Track For 2025

PCI-SIG this week released version 0.5 of the PCI-Express 7.0 specification to its members. This is the second draft of the spec and the final call for PCI-SIG members...

18 by Anton Shilov on 4/4/2024

Samsung Unveils CXL Memory Module Box: Up to 16 TB at 60 GB/s

Composable disaggregated data center infrastructure promises to change the way data centers for modern workloads are built. However, to fully realize the potential of new technologies, such as CXL...

17 by Anton Shilov on 4/3/2024

Rapidus to Get $3.9 Billion in Government Aid for 2nm, Multi-Chiplet Technologies

Rapidus, a Japan-based company developing 2nm process technology and aiming to commercialize it in 2027, will receive a huge government grant for its ongoing projects. The Japanese government will...

10 by Anton Shilov on 4/2/2024

Introspect Intros GDDR7 Test System For Fast GDDR7 GPU Design Bring Up

Introspect this week introduced its M5512 GDDR7 memory test system, which is designed for testing GDDR7 memory controllers, physical interface, and GDDR7 SGRAM chips. The tool will enable memory...

0 by Anton Shilov on 3/29/2024

Western Digital Ships 24TB Red Pro Hard Drive For NASes [UPDATED]

Nowadays highest-capacity hard drives are typically aimed at cloud service providers (CSPs) and enterprises, but this does not mean that creative professionals or regular users do not need them...

18 by Anton Shilov on 3/28/2024

HBM Revenue Poised To Cross $10B as SK hynix Predicts First Double-Digit Revenue Share

Offering some rare insight into the scale of HBM memory sales – and on its growth in the face of unprecedented demand from AI accelerator vendors – the company...

6 by Anton Shilov on 3/28/2024

GDDR7 Approaches: Samsung Lists GDDR7 Memory Chips on Its Product Catalog

Now that JEDEC has published specification of GDDR7 memory, memory manufacturers are beginning to announce their initial products. The first out of the gate for this generation is Samsung...

18 by Anton Shilov on 3/27/2024

Report: SK Hynix Mulls Building $4 Billion Advanced Packaging Facility in Indiana

SK hynix is considering whether to build an advanced packaging facility in Indiana, reports the Wall Street Journal. If the company proceeds with the plan, it intends to invest...

4 by Anton Shilov on 3/26/2024

Intel Announces Expansion to AI PC Dev Program, Aims to Reach More Software & Hardware Devs

Today, Intel announced that it is looking to progress its AI PC Acceleration program further by offering various new toolkits and devkits designed for software and hardware AI developers...

8 by Gavin Bonshor on 3/26/2024

Report: China to Pivot from AMD & Intel CPUs To Domestic Chips in Government PCs

China has initiated a policy shift to eliminate American processors from government computers and servers, reports Financial Times. The decision is aimed to gradually eliminate processors from AMD and...

12 by Anton Shilov on 3/26/2024

Construction of $106B SK hynix Mega Fab Site Moving Along, But At Slower Pace

When a major industry slowdown occurs, big companies tend to slowdown their mid-term and long-term capacity related investments. This is exactly what happened to SK hynix's Yongin Semiconductor Cluster...

8 by Anton Shilov on 3/23/2024

Micron Samples 256 GB DDR5-8800 MCR DIMMs: Massive Modules for Massive Servers

Micron this week announced that it had begun sampling of its 256 GB multiplexer combined (MCR) DIMMs, the company's highest-capacity memory modules to date. These brand-new DDR5-based MCRDIMMs are...

4 by Anton Shilov on 3/22/2024
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