JEDEC Extends DDR5 Memory Specification to 8800 MT/s, Adds Anti-Rowhammer Features

When JEDEC released its DDR5 specification (JESD79) back in 2020, the standard setting organization defined precise specs for modules with speed bins of up to 6400 MT/s, while leaving...

14 by Anton Shilov on 4/22/2024

SK Hynix and TSMC Team Up for HBM4 Development

SK hynix and TSMC announced early on Friday that they had signed a memorandum of understanding to collaborate on developing the next-generation HBM4 memory and advanced packaging technology. The...

5 by Anton Shilov on 4/19/2024

TSMC Posts Q1'24 Results: 3nm Revenue Share Drops Steeply, but HPC Share Rises

Taiwan Semiconductor Manufacturing Co. this week released its financial results for Q1 2024. Due to a rebound in demand for semiconductors, the company garned $18.87 billion in revenue for...

11 by Anton Shilov on 4/19/2024

ASML Patterns First Wafer Using High-NA EUV Tool, Ships Second High-NA Scanner

This week ASML is making two very important announcements related to their progress with high numerical aperature extreme ultraviolet lithography (High-NA EUV). First up, the company's High-NA EUV prototype...

13 by Anton Shilov on 4/18/2024

Samsung Unveils 10.7Gbps LPDDR5X Memory - The Fastest Yet

Samsung today has announced that they have developed an even faster generation of LPDDR5X memory that is set to top out at LPDDR5X-10700 speeds. The updated memory is slated...

6 by Anton Shilov on 4/17/2024

Samsung To Receive $6.4 Billion Under CHIPS Act to Build $40 Billion Fab in Texas

Samsung Electronics this week was awarded up to $6.4 billion from the U.S. government under the CHIPS and Science Act to build its new fab complex in Taylor, Texas...

5 by Anton Shilov on 4/16/2024

Corsair Enters Workstation Memory Market with WS Series XMP/EXPO DDR5 RDIMMs

Corsair has introduced a family of registered memory modules with ECC that are designed for AMD's Ryzen Threadripper 7000 and Intel's Xeon W-2400/3400-series processors. The new Corsair WS DDR5...

9 by Anton Shilov on 4/12/2024

Western Digital Previews 4 TB SD Card: World's Highest-Capacity

Western Digital this week is previewing the industry's first 4 TB SD card. The device is being showcased at the NAB trade show for broadcasters and content creators and...

15 by Anton Shilov on 4/11/2024

Intel To Discontinue Boxed 13th Gen Core CPUs for Enthusiasts

In an unexpected move, Intel has announced plans to phase out the boxed versions of its enthusiasts-class 13th Generation Core 'Raptor Lake' processors. According to a product change notification...

5 by Anton Shilov on 4/10/2024

Report: Impact of Taiwanese Earthquake on DRAM Output to be Negligible in Q2

Following the magnitude 7.2 earthquake that struck Taiwan on April 3, 2024, there was immediate concern over what impact this could have on chip production within the country. Even...

2 by Anton Shilov on 4/10/2024

Google Develops In-House Arm 'Axion' CPU for Datacenters

Google was among the first hyperscalers build custom silicon for its services, starting first with tensor processing units (TPUs) for its AI initiatives, and then video transcoding units (VCUs...

15 by Anton Shilov on 4/9/2024

TSMC to Receive $6.6B Under US CHIPS Act, Set to Build 2nm Fab in Arizona

TSMC has entered into a preliminary agreement with the U.S. Department of Commerce, securing up to $6.6 billion in direct funding and access to up to $5 billion in...

23 by Anton Shilov on 4/8/2024

SK hynix to Build $3.87 Billion Memory Packaging Fab in the U.S. for HBM4 and Beyond

SK hynix this week announced plans to build its advanced memory packaging facility in West Lafayette, Indiana. The move can be considered as a milestone both for the memory...

7 by Anton Shilov on 4/5/2024

PCIe 7.0 Draft 0.5 Spec Available: 512 GB/s over PCIe x16 On Track For 2025

PCI-SIG this week released version 0.5 of the PCI-Express 7.0 specification to its members. This is the second draft of the spec and the final call for PCI-SIG members...

18 by Anton Shilov on 4/4/2024

Samsung Unveils CXL Memory Module Box: Up to 16 TB at 60 GB/s

Composable disaggregated data center infrastructure promises to change the way data centers for modern workloads are built. However, to fully realize the potential of new technologies, such as CXL...

17 by Anton Shilov on 4/3/2024

Rapidus to Get $3.9 Billion in Government Aid for 2nm, Multi-Chiplet Technologies

Rapidus, a Japan-based company developing 2nm process technology and aiming to commercialize it in 2027, will receive a huge government grant for its ongoing projects. The Japanese government will...

10 by Anton Shilov on 4/2/2024

Introspect Intros GDDR7 Test System For Fast GDDR7 GPU Design Bring Up

Introspect this week introduced its M5512 GDDR7 memory test system, which is designed for testing GDDR7 memory controllers, physical interface, and GDDR7 SGRAM chips. The tool will enable memory...

0 by Anton Shilov on 3/29/2024

Western Digital Ships 24TB Red Pro Hard Drive For NASes [UPDATED]

Nowadays highest-capacity hard drives are typically aimed at cloud service providers (CSPs) and enterprises, but this does not mean that creative professionals or regular users do not need them...

18 by Anton Shilov on 3/28/2024

HBM Revenue Poised To Cross $10B as SK hynix Predicts First Double-Digit Revenue Share

Offering some rare insight into the scale of HBM memory sales – and on its growth in the face of unprecedented demand from AI accelerator vendors – the company...

6 by Anton Shilov on 3/28/2024

GDDR7 Approaches: Samsung Lists GDDR7 Memory Chips on Its Product Catalog

Now that JEDEC has published specification of GDDR7 memory, memory manufacturers are beginning to announce their initial products. The first out of the gate for this generation is Samsung...

18 by Anton Shilov on 3/27/2024

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