Memory

Samsung has successfully validated its new LPDDR5X-10700 memory with MediaTek's upcoming Dimensity platform. At present, 10.7 GT/s is the highest performing speed grade of LPDDR5X DRAM slated to be released this year, so the upcoming Dimensity 9400 system-on-chip will get the highest memory bandwidth available for a mobile application processor. The verification process involved Samsung's 16 GB LPDDR5X package and MediaTek's soon-to-be-announced Dimensity 9400 SoC for high-end 5G smartphones. Usage of LPDDR5X-10700 provides a memory bandwidth of 85.6 GB/second over a 64-bit interface, which will be available for bandwidth-hungry applications like graphics and generative AI. "Working together with Samsung Electronics has made it possible for MediaTek's next-generation Dimensity chipset to become the world's first to be validated at LPDDR5X operating speeds up to 10.7Gbps, enabling upcoming...

Micron to Ship HBM3E Memory to NVIDIA in Early 2024

Micron has reaffirmed plans to start shipments of its HBM3E memory in high volume in early 2024, while also revealing that NVIDIA is one of its primary customers for...

7 by Anton Shilov on 9/28/2023

Micron Samples 128 GB Modules Based on 32 Gb DDR5 ICs

Micron is sampling 128 GB DDR5 memory modules, the company said at its earnings call this week. The modules are based on the company's latest single die, non-stacked 32...

9 by Anton Shilov on 9/28/2023

Corsair's Dominator Titanium Memory Now Available, Unveils Plans for Beyond 8000 MT/s

Corsair has started sales of its Dominator Titanium memory modules that were formally introduced this May. The new modules bring together luxurious look, customizable design, and extreme data transfer...

1 by Anton Shilov on 9/26/2023

Modular LPDDR Memory Becomes A Reality: Samsung Introduces LPCAMM Memory Modules

Although Low Power DDR(LPDDR) memory has played a pivotal role in reducing PC laptop power usage, the drawback to the mobile-focused memory has always been its tight signaling and...

30 by Ryan Smith on 9/25/2023

Samsung Unveils Industry's First 32Gbit DDR5 Memory Die: 1TB Modules Incoming

Samsung early on Friday revealed the world's first 32 Gb DDR5 DRAM die. The new memory die is made on the company's 12 nm-class DRAM fabrication process and not...

6 by Anton Shilov on 9/1/2023

SK hynix Begins Sampling HBM3e, Volume Production Planned For H1 2024

SK hynix on Monday announced that it had completed initial development of its first HBM3E memory stacks, and has begun sampling the memory to a customer. The updated ("extended"...

4 by Anton Shilov on 8/21/2023

Samsung, MemVerge, and H3 Build 2TB CXL Memory Pool

Samsung, MemVerge, H3 Platform, and XConn have jointly unveiled their 2 TB Pooled CXL Memory System at the Flash Memory Summit. The device can be connected to up to...

4 by Anton Shilov on 8/14/2023

SK Hynix Launches 24GB LPDDR5X-8500 Stacks for Smartphones, PCs, and HPC

On Friday, SK Hynix said it had started mass production of 24 GB LPDDR5X memory stacks that can be used for ultra-high-end smartphones and PCs. The company's LPDDR5X-8500 devices...

10 by Anton Shilov on 8/11/2023

Memory Makers on Track to Double HBM Output in 2023

TrendForce projects a remarkable 105% increase in annual bit shipments of high-bandwidth memory (HBM) this year. This boost comes in response to soaring demands from AI and high-performance computing...

9 by Anton Shilov on 8/9/2023

SK Hynix Shows Off 321-Layer 3D TLC NAND Device

SK Hynix showcased its 321-layer TLC NAND memory at the Flash Memory Summit 2023. The South Korean company is the first NAND maker to publicly demonstrate 3D NAND with...

11 by Anton Shilov on 8/9/2023

Micron's CZ120 CXL Memory Expansion Modules Unveiled: 128GB and 256GB

This week, Micron announced the sample availability of its first CXL 2.0 memory expansion modules for servers that promise easy and cheap DRAM subsystem expansions. Modern server platforms from...

7 by Anton Shilov on 8/9/2023

TeamGroup Unveils JEDEC-Spec DDR5-6400 Memory Kits: Faster 1.1V DDR5 On The Way For Future CPUs

While DDR5 memory has been out and in use for a couple of years now, so far we haven't seen the memory reach its full potential – at least...

5 by Anton Shilov on 7/31/2023

Samsung Begins to Produce Third 3nm Chip Amid Massive Losses On DRAM & NAND

Samsung this week reported their financial results for the second quarter of 2023, closing the book on an especially bleak quarter of the year with a massive $3.4 billion...

14 by Anton Shilov on 7/28/2023

Micron Publishes Updated DRAM Roadmap: 32 Gb DDR5 DRAMs, GDDR7, HBMNext

In addition to unveiling its first HBM3 memory products yesterday, Micron also published a fresh DRAM roadmap for its AI customers for the coming years. Being one of the...

4 by Anton Shilov on 7/27/2023

Micron Unveils HBM3 Gen2 Memory: 1.2 TB/sec Memory Stacks For HPC and AI Processors

Micron today is introducing its first HBM3 memory products, becoming the latest of the major memory manufacturers to start building the high bandwidth memory that's widely used in server-grade...

7 by Anton Shilov on 7/26/2023

Cadence Buys Memory and SerDes PHY Assets from Rambus

In a surprising turn of events, Cadence and Rambus entered into a definitive agreement late last week for Cadence to buy memory physical interface IP and SerDes businesses from...

5 by Anton Shilov on 7/24/2023

Samsung Completes Initial GDDR7 Development: First Parts to Reach Up to 32Gbps/pin

Samsung has announced this evening that they have completed development on their first generation of GDDR7 memory. The next iteration of the high bandwidth memory technology, which has been...

11 by Ryan Smith on 7/18/2023

Micron Expects to Debut GDDR7 Memory in 2024

Micron late on Wednesday revealed plans to introduce its first GDDR7 memory devices in the first half of 2024. The memory is expected to be used by next generation...

12 by Anton Shilov on 6/29/2023

G.Skill's 24GB DDR5-6000 Modules with AMD EXPO Profiles Released

G.Skill has quietly started selling its 24 GB DDR5 memory modules with AMD EXPO profiles for single-click overclocking. G.Skill's Trident Z5 Neo RGB modules are among the first EXPO-profiled...

4 by Anton Shilov on 6/28/2023

SK Hynix Starts Production of 238-Layer 3D NAND: 34% Denser with 2.4 GT/s Interface

SK Hynix announced this week that it had started volume production of its 238-layer TLC NAND memory. The new device promises higher bit density and lower NAND bits cost...

5 by Anton Shilov on 6/8/2023

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